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99.7 Alumina Ceramics
Chemshun Ceramics
69091200
Al2O3 99.7% Alumina Wafer Polishing Plate / Turn Table
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Application:
As an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapphire and Wafer.
Features :
- High rigidity (Hardness, Mechanical Strength, Wear Resistance)
- High chemical durability
- Surface shape & roughness control
- Pretty Price
Size:
- Disc, ring size below ∅850mm, thickness 45mm.
- For example: D150mm, D360mm,D 600mm.
- Customized products with various size are accepted.
Main Parameter : (Chemical / physical)
Property | Unit | Chemshun Product |
Density | g/cm3 | 3.94-3.97 |
Al2O3 | % | 99.7-99.9 |
Vickers hardness | GPa | ≧17 |
Three-point bending strength | MPa | 440-550 |
Cm2/S | 0.0968 | |
Modulus of Elasticity | Gpa | 356 |
Al2O3 99.7% Alumina Wafer Polishing Plate / Turn Table
| | |
Application:
As an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapphire and Wafer.
Features :
- High rigidity (Hardness, Mechanical Strength, Wear Resistance)
- High chemical durability
- Surface shape & roughness control
- Pretty Price
Size:
- Disc, ring size below ∅850mm, thickness 45mm.
- For example: D150mm, D360mm,D 600mm.
- Customized products with various size are accepted.
Main Parameter : (Chemical / physical)
Property | Unit | Chemshun Product |
Density | g/cm3 | 3.94-3.97 |
Al2O3 | % | 99.7-99.9 |
Vickers hardness | GPa | ≧17 |
Three-point bending strength | MPa | 440-550 |
Cm2/S | 0.0968 | |
Modulus of Elasticity | Gpa | 356 |
