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What factors affect the removal rate and surface roughness of ceramic grinders when grinding sapphire wafers?

Views: 1     Author: Chemshun Ceramics      Publish Time: 2020-07-07      Origin:


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Sapphire wafers have excellent characteristics such as high hardness, light transmission, high wear resistance, good chemical stability, electromagnetic insulation, etc., and have been widely used in many fields such as industry and scientific research. In order to meet the ultra-smooth surface requirements of sapphire, during the grinding process of high-purity alumina ceramic grinding disc plate using a ceramic grinder, pay attention to the following factors that will affect the surface removal rate and surface roughness of the sapphire wafer.

1. The greater the hardness of the abrasive, the greater the scratches on the surface of the material;

2. The removal rate of the processed surface is closely related to the material flow of the abrasive. The larger the abrasive grain, the greater the mechanical effect between the abrasive grain and the contact surface of the workpiece surface, and the higher the removal rate of the surface. Conversely, the smaller the particle size, the weaker the mechanical action and the lower the removal rate.

3. The polishing liquid contains effective abrasive particles. When the concentration of the abrasive increases and the particles remain unchanged, its mechanical effect will increase; the removal rate of the wafer surface increases. If the polishing liquid is too low, the surface removal rate will not increase when the concentration reaches a certain amount. On the contrary, when the concentration of the polishing liquid is too low, it will cause friction between the polishing disk and the wafer, and the surface roughness will be increased when the wafer is scratched.

4. When the grinding pressure increases during the grinding process, the amount of material removed will also increase. The amount of removal is around a specific pressure value range, for example: 10M pressure reaches the maximum removal amount. When the grinding pressure is less than a specific pressure value, the removal effect of the wafer surface is not significant. When the grinding pressure is too large, it will cause the anesthetic material to be crushed due to the excessive pressure, or pressed into the grinding disk due to the high hardness of the abrasive. No effective grinding effect is produced, and the roughness of the wafer surface is also increased.

 Pingxiang Chemshun Ceramics Co., Ltd. produces 99.7% AL2O3 high-purity alumina ceramic grinding discs, professionally used for grinding and polishing sapphire and wafers. The sizes are Diameter 15", 18", 24", D360MM, D450MM, D600MM, etc. We also accept customized sizes from customers.

                                                  High Chemical Durability Alumina Ceramic Wafer Polishing Plate


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